A Comprehensive Guide to Common PCB Design Terminology: Definitions and Insights for Engineers"

Common PCB Design Terms (with Definitions)

1. Printed Circuit Board (PCB)

A flat, rigid or flexible board made of insulating material (e.g., FR-4) that mechanically supports and electrically connects components via conductive pathways (traces), pads, and other features etched from copper sheets.

2. Layer

A distinct stratum in a PCB, which can be a signal layer (for routing traces), ground plane, power plane, or dielectric layer (insulating material between conductive layers).

3. Trace

A thin, conductive copper pathway on a PCB that carries electrical signals between components. Traces are etched from copper foil and can vary in width, length, and thickness.

4. Pad

A circular or shaped copper area on a PCB where a component lead or solder joint is attached. Pads can be through-hole (for through-hole components) or surface-mount (for SMD components).

5. Via

A hole in the PCB that connects traces or planes between different layers. Common types include:

- Through-Via: Passes through all layers.

- Blind Via: Connects the outer layer to an inner layer (not fully through).

- Buried Via: Connects inner layers without reaching the surface.

6. Ground Plane

A solid layer of copper (usually on an inner layer) that provides a common electrical ground reference, improving signal integrity and noise reduction.

7. Power Plane

A solid copper layer dedicated to distributing power to components, often paired with a ground plane for stable voltage supply.

8. Dielectric Material

The insulating layer between conductive layers (e.g., FR-4, Rogers, or ceramic), which affects signal speed, impedance, and thermal properties.

9. Impedance Control

The practice of designing traces to have a specific characteristic impedance (e.g., 50Ω, 75Ω) to minimize signal reflections in high-speed circuits. Key factors: trace width, dielectric thickness, and copper thickness.

10. Surface Mount Technology (SMT/SMD)

A method of attaching components directly to the surface of a PCB using surface-mount pads, eliminating the need for through-holes. Examples: QFP, BGA, 0603 resistors.

11. Through-Hole Technology

Components (e.g., DIP, connectors) with leads inserted through holes in the PCB, secured with solder on the opposite side.

12. Ball Grid Array (BGA)

A surface-mount package with an array of solder balls on the underside for high-density interconnections, common in microprocessors and ICs.

13. Silkscreen (Silkscreen Layer)

A non-conductive, ink-printed layer on the PCB surface (top/bottom) that labels component positions, reference designators (e.g., R1, C2), and polarity marks.

14. Solder Mask

A protective, insulating layer (usually green, but available in other colors) that covers the PCB surface, except for pads and vias, to prevent accidental solder bridges and protect copper from oxidation.

15. Copper Foil Thickness

The thickness of the copper layer on a PCB, measured in ounces per square foot (e.g., 1 oz = 35μm), which impacts current-carrying capacity and trace resistance.

16. Design for Manufacturing (DFM)

The practice of designing PCBs to ensure manufacturability, cost-effectiveness, and reliability by adhering to fabrication constraints (e.g., minimum trace width, drill size, clearance).

17. Gerber File

A standard format for sending PCB design data to manufacturers, including layer geometries, drill files, and assembly information.

18. Electromagnetic Compatibility (EMC/EMI)

EMC: The ability of a PCB to function correctly in its electromagnetic environment without interfering with other devices.
EMI: Electromagnetic interference caused by or affecting the PCB, mitigated through grounding, shielding, and layout techniques.

19. Stackup

The arrangement of layers in a multi-layer PCB, specifying the order of signal layers, planes, dielectric materials, and their thicknesses—critical for impedance control and thermal management.

20. Flying Probe Test

A automated testing method using movable probes to verify PCB connectivity and component placement without a custom fixture, suitable for low-volume production.

This list covers foundational terms for readers new to PCB design, with technical accuracy and practical context.

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