Successful custom rigid flex PCB and PCBA manufacturing begins at the engineering stage. Without careful planning of stack-up, material selection, and bend areas, performance and reliability may be compromised.

Stack-Up Design and Material Selection

Rigid-flex boards combine FR4 rigid cores with flexible polyimide layers. The number of layers, copper thickness, and bonding adhesives must be carefully calculated.

Improper stack-up design can lead to delamination or impedance instability. That’s why early DFM review plays a critical role in custom rigid flex PCB and PCBA manufacturing.

Bend Radius and Mechanical Planning

Flex sections must meet minimum bend radius requirements to avoid copper cracking. Engineers must also define static vs. dynamic bending conditions during product life cycles.

Controlled Impedance and Signal Integrity

For high-speed communication or data transmission systems, controlled impedance routing is essential. Rigid-flex PCBs allow optimized signal layer placement, improving performance while maintaining compact design.

Assembly Process Control

During SMT assembly, rigid and flexible areas must be handled differently. Custom fixtures prevent mechanical stress on flexible sections during reflow. Thermal profile optimization ensures reliable solder joints.

An integrated manufacturer offering both fabrication and assembly reduces coordination errors and ensures stable production outcomes.

About Ring PCB

Ring PCB specializes in custom printed circuit boards, rigid-flex PCB fabrication, SMT assembly, and full-turnkey PCBA services.

With 18 years of experience, 500 employees, and 10,000 square meters of self-operated facilities, we ensure consistent quality and controlled production. Certified under ISO9001, ISO14001, ISO13485, and IATF16949, we support rapid prototyping and scalable production for global customers.

We sincerely look forward to cooperating with you.